羽杰锐净SC-800是专为SiC外延前清洗研发的高性能清洗剂。通过氧化-络合协同技术，高效去除颗粒、金属及有机物，实现原子级洁净表面，完美替代进口品牌，提升外延质量与产业链安全。提供样品测试。

羽杰锐净SC800碳化硅外延片专用清洗剂产品介绍

Jie Sharp SC800 Silicon Carbide Epitaxial Wafer专用清洗剂 Product Introduction

 一、 产品概述与核心价值 | Product Overview and Core Value

羽杰锐净SC800 是深圳市羽杰科技有限公司面向第三代半导体产业，倾力研发的旗舰型碳化硅（SiC）外延片专用清洗剂。本产品专为碳化硅衬底在外延生长前的终极精密清洗而设计，旨在一步高效去除抛光后的各类复杂污染物，为高质量外延生长提供原子级洁净、化学态完美的表面。

Jie Sharp SC800 is a flagship proprietary cleaner for Silicon Carbide (SiC) epitaxial wafers, meticulously developed by Shenzhen Yujie Technology Co., Ltd. for the thirdgeneration semiconductor industry. Specifically designed for the ultimate precision cleaning of SiC substrates prior to epitaxial growth, it aims to efficiently remove various complex contaminants postpolishing in a single step, providing an atomically clean and chemically perfect surface for highquality epitaxial deposition.

面对当前进口清洗剂品牌溢价高、交货周期长、技术响应慢的行业痛点，SC800以 “性能超越、供应安全、服务敏捷” 为使命，通过底层配方创新与严苛的品控体系，成功实现了对国际一线品牌产品的优质替代与性能超越，是提升国产碳化硅产业链自主可控性与竞争力的关键材料解决方案。

Addressing current industry pain points such as high premium costs, long delivery cycles, and slow technical support from imported cleaner brands, SC800 is committed to the mission of "performance superiority, supply security, and service agility." Through fundamental formulation innovation and a stringent quality control system, it has successfully achieved a superior alternative and performance surpassing that of leading international brands, representing a key material solution to enhance the autonomy and competitiveness of the domestic SiC supply chain.

 二、 核心技术突破与设计理念 | Core Technological Breakthroughs and Design Philosophy

SC800的研发摒弃了传统的单一功能思路，独创 “协同净化”分子设计理念，通过多重机制联动，实现对污染物从“松动”到“剥离”再到“稳定运离”的全流程精准打击。

The development of SC800 departs from traditional singlefunction approaches, pioneering a unique "Synergistic Purification" molecular design philosophy. It achieves precise, fullprocess removal of contaminantsfrom "loosening" to "stripping" and finally to "stable removal"through the联动 of multiple mechanisms.

1.  氧化络合协同净化机制 | OxidationChelation Synergistic Purification Mechanism

产品内置温和可控的氧化组分与靶向多齿络合组分。氧化组分能在衬底表面构建均一的超薄亲水层，有效松动有机残留及氧化层；随即，高效络合组分迅速捕捉并牢牢锁住游离的金属离子（如Fe、Al、Cu、Ni等）及金属氧化物微粒，形成稳定可溶的络合物。此协同机制从根本上解决了传统清洗剂对“有机金属复合污染物”清洗不彻底的难题。

The product incorporates a mild and controllable oxidizing agent and targeted multidentate chelating agents. The oxidizing agent builds a uniform, ultrathin hydrophilic layer on the substrate surface, effectively loosening organic residues and the oxide layer. Subsequently, the highly efficient chelating agents rapidly capture and securely bind free metal ions (e.g., Fe, Al, Cu, Ni) and metal oxide particles, forming stable, soluble complexes. This synergistic mechanism fundamentally solves the problem of incomplete cleaning of "organicmetal composite contaminants" by traditional cleaners.

2.  三重表面活性剂协同矩阵 | Triple Surfactant Synergistic Matrix

创新性地复配了润湿渗透型、生物基乳化型及静电排斥型表面活性单元。该矩阵能瞬时降低药液表面张力，快速渗透至污染物与SiC的纳米级界面，通过润湿、卷离、乳化等多种作用力强力剥离污染物。最关键的是，其独特的静电排斥与空间位阻效应，能有效防止已被剥离的亚微米级颗粒再次吸附到晶圆表面，确保污染物被永久性带离，攻克了清洗中的“二次污染”核心痛点。

It innovatively formulates a compound of wettingpenetrating, biobased emulsifying, and electrostatic repelling surfactant units. This matrix instantly reduces the solution's surface tension, enabling rapid penetration into the nanoscale interface between contaminants and SiC, and forcefully strips contaminants through various forces like wetting, rollingup, and emulsification. Most crucially, its unique electrostatic repulsion and steric hindrance effects effectively prevent readsorption of stripped submicron particles onto the wafer surface, ensuring permanent contaminant removal and overcoming the core challenge of "recontamination" during cleaning.

3.  近中性温和腐蚀控制体系 | NearNeutral Mild Etching Control System

产品精确将工作pH值稳定在8.8±0.1的弱碱性区间。此环境既为上述协同机制提供了最佳活性舞台，又确保了对碳化硅衬底本体的腐蚀速率降至可忽略不计的水平（经AFM验证，表面粗糙度变化ΔRa

The product precisely maintains the operating pH within a weakly alkaline range of 8.8 ± 0.1. This environment not only provides the optimal stage for the aforementioned synergistic mechanisms but also ensures an etching rate on the SiC substrate body that is negligible (verified by AFM, surface roughness change ΔRa

四、 产品典型应用与工艺集成 | Typical Applications and Process Integration

   适用工艺环节 | Applicable Process Step: 主要用于碳化硅衬底在化学机械抛光（CMP）后、外延生长前的最终精密清洗步骤。

Primarily used for the final precision cleaning step of SiC substrates after Chemical Mechanical Polishing (CMP) and before epitaxial growth.

   兼容性 | Compatibility: 适用于主流湿法清洗设备，兼容溢流、喷雾、兆声波（Megasonic）等多种清洗模式。与石英、PVDF、PTFE等半导体级材质完全兼容。

Compatible with mainstream wet bench清洗 equipment, supporting various cleaning modes such as overflow, spray, and Megasonic. Fully compatible with semiconductorgrade materials like quartz, PVDF, and PTFE.

   推荐工艺 | Recommended Process:

1.  SC800主清洗 | SC800 Main Clean: 建议使用浓度100%，温度5060°C，处理时间510分钟（可根据污染程度调整），建议配合兆声波能量以最大化颗粒去除效果。

Recommended concentration 100%, temperature 5060°C, process time 510 minutes (adjustable based on contamination level). Megasonic energy is recommended to maximize particle removal efficiency.

2.  超纯水（UPW）漂洗 | UltraPure Water (UPW) Rinse: 建议采用多级阶梯式溢流漂洗，确保残留药液被彻底清除。

A multistage cascade overflow rinse is recommended to ensure complete removal of residual chemistry.

3.  氮气干燥 | Drying: 使用IPA干燥或热氮气干燥，获得完美干爽表面。

Use IPA vapor drying or hot N2 drying to obtain a perfectly dry surface.

 五、 品质保证与技术服务 | Quality Assurance and Technical Service

   超纯品质 | UltraHigh Purity Quality: 所有批次产品均在百级洁净环境下生产、过滤与灌装，采用≥18.2 MΩ·cm的超纯水为基质，并通过0.02μm超滤终端过滤，确保产品本身无颗粒引入风险。

All batches are manufactured, filtered, and packaged in a Class 100 cleanroom environment. Using ultrapure water (≥18.2 MΩ·cm) as the base and filtered through a 0.02μm ultrafiltration final filter to ensure the product itself introduces no particle risk.

   数据包支持 | Data Package Support: 随货提供详尽的批次质量分析证书（CoA），包含关键离子浓度、颗粒计数、pH值、表面张力等全谱数据。

A comprehensive Certificate of Analysis (CoA) is provided with each shipment, containing fullspectrum data including key ion concentrations, particle counts, pH value, and surface tension.

   定制化支持 | Customized Support: 羽杰科技拥有强大的应用实验室，可为客户提供工艺调试、污染物分析、对比清洗验证等全方位技术服务，助力客户快速实现产线导入与良率提升。

Yujie Technology possesses a wellequipped application laboratory and can provide customers with comprehensive technical services such as process debugging, contaminant analysis, and comparative cleaning validation, assisting customers in rapid production line integration and yield improvement.

深圳市羽杰科技有限公司致力于成为国产高端半导体材料的领航者。羽杰锐净SC800不仅仅是一款产品，更是我们与客户共同推进碳化硅产业国产化进程的坚实承诺。

Shenzhen Yujie Technology Co., Ltd. is committed to becoming a leader in domestic highend semiconductor materials. Jie Sharp SC800 is not merely a product; it is our solid commitment to advancing the localization of the silicon carbide industry together with our customers.

如需样品测试或技术咨询，敬请垂询。 | For sample testing or technical consultation, please feel free to contact us.

本文标题：羽杰锐净SC-800碳化硅外延片清洗剂 | 国产替代 性能超越 | 羽杰科技

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